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EN 17460
DIN 6701
DIN 6701 / EN17460
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EN17460
DIN6701
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Class A1
Class A2
Class A3
Main function
F - Force transfer using high-modulus adhesives
D - Deformation compensation using low-modulus adhesives (thick film bonding)
S - Sealing
L - Large-area adhesive bonding (e.g. lamination)
Pre-treatment methods
BL - Blasting
ET - Etching, anodization
PL - Plasma treatment (AD plasma, corona, flame treatment, flame pyrolysis)
LS - Laser treatment
Production methods
SO - Use of solvent or water based systems (primer, adhesives, cleaning agents, etc.)
TK - Processing of 2-component-adhesives
HU - Processing of 1-component moisture/humidity activated systems (adhesives, primers)
HE - Processing of heat-curing adhesives
HM - Processing hotmelts
RA - Processing of radiation-curing adhesives
AN - Processing of anaerobically curing adhesives
LA - Lamination or processing of pressure-sensitive adhesives
Test methods
DT - Destructive test methods
NDT - Non-destructive test methods (comment required)
VIS - Visible inspection (with inspection instructions)
DC - Application monitoring using electrical data processing techniques
CY - Cyclic-mechanical ageing tests (oscillation)
IM - Crash/impact test methods
PC - Physical-chemical ageing tests
RH - Rheological measurements
RS - Spectroscopic analyses (IR, UV-VIS)
TA - Thermal analytical methods (DSC, DMA, TGA, etc.)
WT - Wetting measurements
Degree of mechanization
VM - Mechanized/automated
TM - Partly mechanized
M - Manual
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