| # |
Group |
Description |
Code |
| 1 |
Main function |
Force transfer using high-modulus adhesives |
F |
| 2 |
|
Deformation compensation using low-modulus adhesives (thick film bonding) |
D |
| 3 |
|
Sealing |
S |
| 4 |
|
Large-area adhesive bonding (e.g. lamination) |
L |
| 5 |
Pre-treatment methods |
Blasting |
BL |
| 6 |
|
Etching, anodization |
ET |
| 7 |
|
Plasma treatment (AD plasma, corona, flame treatment, flame pyrolysis) |
PL |
| 8 |
|
Laser treatment |
LS |
| 9 |
Production methods |
Use of solvent or water based systems (primer, adhesives, cleaning agents, etc.) |
SO |
| 10 |
|
Processing of 2-component-adhesives |
TK |
| 11 |
|
Processing of 1-component moisture/humidity activated systems (adhesives, primers) |
HU |
| 12 |
|
Processing of heat-curing adhesives |
HE |
| 13 |
|
Processing hotmelts |
HM |
| 14 |
|
Processing of radiation-curing adhesives |
RA |
| 15 |
|
Processing of anaerobically curing adhesives |
AN |
| 16 |
|
Lamination or processing of pressure-sensitive adhesives |
LA |
| 17 |
Test methods |
Destructive test methods |
DT |
| 18 |
|
Non-destructive test methods (comment required) |
NDT |
| 19 |
|
Visible inspection (with inspection instructions) |
VIS |
| 20 |
|
Application monitoring using electrical data processing techniques |
DC |
| 21 |
|
Cyclic-mechanical ageing tests (oscillation) |
CY |
| 22 |
|
Crash/impact test methods |
IM |
| 23 |
|
Physical-chemical ageing tests |
PC |
| 24 |
|
Rheological measurements |
RH |
| 25 |
|
Spectroscopic analyses (IR, UV-VIS) |
RS |
| 26 |
|
Thermal analytical methods (DSC, DMA, TGA, etc.) |
TA |
| 27 |
|
Wetting measurements |
WT |
| 28 |
Degree of mechanization |
Mechanized/automated |
VM |
| 29 |
|
Partly mechanized |
TM |
| 30 |
|
Manual |
M |